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Semiconductor/
LED Inspection System
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AXOMETRICS
Imaging Spectroscopic Ellipsometer 		Use rotating Compensator (PSCA) configuration ellipsometer with 16-bit CCD camera to measure thickness, optical constants n and k value of thin films
AXOMETRICS
Single-point Mueller matrix polarimeter.		 System with large size stage(12”), a single machine can achieve transmission and reflection measurement modes, which is not only used to measure polarization state, retardance, etc., but also LCOS measurement.
FSM 128/500/900
Film Stress Measuring System		 Applied to measuring the uniformity, thickness, and residual stress of film after film deposition process
FSM 413
Multiple Layer Thickness Measuring System		 Semiconsoft, Electronics, LED, FPD, Solar cell, MEMS
HISOL
Manual Prober		 semiconductor R&D, electric failure analysis and manual circuit probing system
Hitachi Power Solutions
Scanning Acoustic Tomograph		 FC bump soldering quality to check with bump crack or underfill with void or not, or BGA, Leadframe package, post molding to check mold compound with delamination or not
INSIDIX
Thermal Deformation Measuring System		 electronics, semiconductors and other products
KOH YOUNG
3D automatic optical inspection		 Semiconductor, SMT, automotive, topography, optical, medicine.
3D measurement inspection solutions for diverse production environment.
KOH YOUNG
3D Solder Paste Inspection		 All kinds of PCB products that experience solder paste printing.
RADIANT
Laser De-capsulation System		 remove the mold compound
SURAGUS
Wafer metal layer resistance \ thickness measuremen		 Germany,Suragus,Providing testing solutions for non-destructive material.
XYZTEC
Bond Tester		 Post wafer bumping, die attachment, wire bond, or BGA balling to check the connections or bonding strength and monitoring the process.
YXLON. International
X-ray Inspection System 		quality control,monitoring post IC packaging, Lab. analysis , also can be used in PCBA, ceramic, LED, solar chip packaging